Apparatus and method for manufacturing an organic electroluminescence display

ABSTRACT

An apparatus for manufacturing an organic electroluminescence display having an alignment chamber for aligning a mask having openings corresponding to a predetermined pattern with a substrate on which a first electrode layer is formed and detachably attaching the mask and the substrate. The apparatus further including a number of vacuum processing chambers for sequentially forming a number of organic material layers on the substrate attached with the mask. The apparatus also including a transfer robot for transferring the attached mask and substrate to one of the number of vacuum processing chambers and sequentially transferring it between the number of the vacuum processing chambers.

BACKGROUND OF THE INVENTION

The present invention relates to both a manufacturing apparatus for anorganic electroluminescence display and a method of manufacturing anorganic electroluminescence display.

An organic electroluminescence element is structured by an organic layerincluding an organic material sandwiched between electrodes made of ananode and a cathode. It is known that when voltage is applied acrossthese electrodes, electrons and holes are injected from the cathode andanode into the organic layer of the organic electroluminescence element.These electrons and holes recombine to emit light.

In such an organic electroluminescence element, a luminescence of, forexample, several hundreds to several tens of thousands of cd/m2 isobtained with a driving voltage of less than 10V. Further, the organicelectroluminescence element can emit light having a suitable color bysuitable selection of the luminous material, that is, the fluorescentmaterial. Thus, a display using organic electroluminescence elementspromises a multi-colored or full-colored display that may take the placeof a cathode ray tube (CRT) display.

As the above described organic layer, an organic layer made of three tofive stacked organic material layers such as a hole injection layer, ahole transfer layer, a light emitting layer, and an electric chargeinjection layer is known. Each of the organic material layers is formedby vapor deposition of the organic material in a processing chamber.

Each organic material layer may be vapor deposited in the sameprocessing chamber. Specifically, vapor deposition includes aligning amask arranged in a processing chamber and having openings correspondingto the pixels of a display with a substrate loaded into the processingchamber, inserting different vapor deposition materials in a number ofheating vessels arranged in the processing chamber corresponding to theorganic material layers, and heating these to cause the evaporation ofthe materials.

However, when forming an organic layer having a number of organicmaterial layers in the same processing chamber, as described above,there are disadvantages in that a cycle time of the process for formingthe organic layer can become extremely long. Thus, mass production ofsuch a display using organic electroluminescence elements can bedifficult.

When forming an organic layer having a number of organic material layersin the same processing chamber, it is necessary to heat each vapordeposition material for each vapor deposition. A relatively long time isneeded until reaching the desired temperature and a relatively long timeis needed until an evaporation rate of a vapor deposition source becomesstable. Thus, the waiting time before starting vapor deposition for eachorganic material layer is extended. As a result, it takes an extremelylong time to form an organic layer.

Conversely, by heating the vapor deposition materials to a predeterminedtemperature at all times to stabilize the evaporation rate, it becomespossible to shorten the waiting time before starting the vapordeposition for each organic material layer. However, while vapordepositing an organic material layer corresponding to one vapordeposition source, vapor deposition materials are also evaporated fromother vapor deposition sources. Thus, wasteful consumption of materialsis hard to avoid. The organic materials used for an organicelectroluminescence element are very costly, so the production cost ofthe organic layer swells and, as a result, the mass production of adisplay using organic electroluminescence elements becomes difficult.

A technique for eliminating some of the disadvantages caused by formingan organic layer in the same processing chamber is disclosed, forexample, in Japanese Unexamined Patent Publication (Kokai) No. 8-111285.

The above publication discloses a technique of arranging processingchambers for vapor deposition of the different organic material layersaround a vacuum chamber and transferring a substrate between theprocessing chambers through the vacuum chamber. By dispersing the vapordeposition of the organic material layers to different processingchambers, it becomes possible to greatly shorten the waiting time forheating the vapor deposition sources and stabilizing the evaporationrate.

However, if dispersing the vapor deposition of the organic materiallayers to different processing chambers, alignment work between thesubstrate and mask becomes necessary in each processing chamber. As aresult, it is very difficult to sufficiently shorten the cycle time ofthe process for forming an organic layer. Further, during the alignmentwork, the vapor deposition materials can be wasted.

SUMMARY OF THE INVENTION

An advantage of the present invention is, therefore, to provide anapparatus for manufacturing an organic electroluminescence display thatis capable of shortening a cycle time of a process for forming anorganic layer of an organic electroluminescence display and that iscapable of suppressing wasteful consumption of organic materials usedfor forming the organic layer.

Another advantage of the present invention is to provide a method ofmanufacturing an organic electroluminescence display that is capable ofshortening a cycle time of a process for forming an organic layer of anorganic electroluminescence display and that is capable of suppressingwasteful consumption of organic materials used for forming the organiclayer.

According to an embodiment of the present invention, a method ofmanufacturing an organic electroluminescence display is provided. Theorganic electroluminescence display has a substrate, a first electrodelayer formed on the substrate with a predetermined pattern, an organiclayer including a number of organic material layers stacked on the firstelectrode layer with a predetermined pattern, and a second electrodelayer formed on the organic layer. The method includes aligning a maskhaving openings corresponding to the predetermined pattern with thesubstrate on which the first electrode layer is formed, detachablyattaching the mask and the substrate, sequentially forming a number oforganic material layers on the substrate attached with the mask in anumber of vacuum processing chambers, and transferring the mask and thesubstrate between the vacuum processing chambers in an attached state.

According to another embodiment of the present invention, an apparatusfor manufacturing an organic electroluminescence display is provided.The organic electroluminescence display has a substrate, a firstelectrode layer formed on the substrate with a predetermined pattern, anorganic layer including a number of organic material layers stacked onthe first electrode layer, with a predetermined pattern, and a secondelectrode layer formed on the organic layer. The apparatus includes analignment mechanism for aligning a mask having openings corresponding tothe predetermined pattern with the substrate on which the firstelectrode layer is formed and detachably attaching the mask and thesubstrate, a number of vacuum processing chambers for sequentiallyforming a number of the organic material layers on the substrateattached with the mask, and a transferring mechanism for transferringthe attached mask and substrate to one of a number of the vacuumchambers and sequentially transferring it among the number of the vacuumprocessing chambers.

In an embodiment according to the present invention, when the mask andthe substrate are aligned and attached, the two are loaded into one ofthe number of vacuum processing chambers in an attached state. Thevacuum processing apparatus into which the mask and substrate are loadedis capable of forming at least one layer of the number of organicmaterial layers producing the organic layer. The organic material layeris formed after the loading is completed.

After forming the at least one of the organic material layers, theattached mask and the substrate are unloaded from the vacuum processingapparatus and then are loaded into another vacuum processing apparatusso that another organic material layer may be stacked. The same processof formation of the organic material layer and the same transfer of themask and the substrate are repeated until the organic layer is formed.

As a result, according to an embodiment of the present invention, theformation of the number of organic layers producing the organic layer isdivided among the number of vacuum processing apparatuses and thetransfer of the substrate between the number of vacuum processingapparatuses is performed in a state with the mask and the substrateattached. As a result, alignment between the mask and the substrate isnot needed and the time for alignment can be eliminated.

Additional features and advantages of the present invention aredescribed in, and will be apparent from, the following DetailedDescription of the Invention and the Figures.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a cross-sectional view of an embodiment of an organicelectroluminescence display according to the present invention showing aportion of a general configuration of a display area of the organicelectroluminescence display.

FIG. 2 is a plan view of an embodiment of an organic electroluminescencedisplay according to the present invention showing a portion of ageneral configuration of a display area of the organicelectroluminescence display.

FIG. 3 is a cross-sectional view of an embodiment of a structure of anorganic layer according to the present invention.

FIG. 4 is a view of a configuration of an apparatus for manufacturing anorganic electroluminescence display according to an embodiment of thepresent invention.

FIG. 5 is a cross-sectional view of a configuration of a substratebefore formation of an organic layer.

FIG. 6 is a perspective view of an embodiment of a structure of a maskand an attachment fixture attaching it to a substrate.

FIG. 7 is a view of a structure of an alignment chamber.

FIG. 8 is a cross-sectional view of an embodiment of a configuration ofa vapor deposition processing chamber.

FIG. 9 is an explanatory view of an embodiment of an operationalprocedure of an alignment mechanism in an alignment chamber.

FIG. 10 is an explanatory view of the operational procedure of thealignment mechanism following FIG. 9.

FIG. 11 is an explanatory view of the operational procedure of thealignment mechanism following FIG. 10.

FIG. 12 is an explanatory view of the operational procedure of thealignment mechanism following FIG. 11.

FIG. 13 is an explanatory view of the operational procedure of thealignment mechanism following FIG. 12.

FIG. 14 is a view illustrating the alignment of a mask to a position offormation of an organic layer on a substrate.

FIG. 15 is an explanatory view of the operational procedure of thealignment mechanism following FIG. 13.

FIG. 16 is an explanatory view of the operational procedure of thealignment mechanism following FIG. 15.

FIG. 17 is an explanatory view of an attached substrate and a maskloaded into a vapor deposition processing chamber.

FIG. 18 is an explanatory view of vapor deposition taking place in avapor deposition processing chamber.

FIG. 19 is an explanatory view of an embodiment of an operationalprocedure of an alignment mechanism in an alignment chamber.

FIG. 20 is an explanatory view of the operational procedure of thealignment mechanism following FIG. 19.

FIG. 21 is a view illustrating the alignment of a mask to a position offormation of an organic layer on a substrate.

FIG. 22 is a view illustrating the alignment of a mask to a position offormation of an organic layer on a substrate.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 and FIG. 2 are views of an example of the organicelectroluminescence display to which the present invention is applied.Specifically, FIG. 1 is a cross-sectional view of a portion of thegeneral configuration of the display area of the organicelectroluminescence display, while FIG. 2 is a plan view of a portion ofthe general configuration of the display area of the organicelectroluminescence display. Note that FIG. 1 is a cross-sectional viewalong the direction of the line A-A′ in FIG. 2. Further, the organicelectroluminescence display shown in FIG. 1 and FIG. 2 is an activematrix type of color display.

The display in FIG. 1 has a substrate 1, a number of thin filmtransistors 2, anode electrodes 10 formed on the transistors 2 via aninterlayer insulating layer 7, and organic layers 11G, 11R, and 11Bwhich are formed on the anode electrodes 10 and emit colors of green(G), red (R), and blue (B) respectively. The display also has a cathodeelectrode 12 formed on the organic layers 11G, 11R, and 11B, atransparent conductive film 16 formed on the cathode electrode 12, and asubstrate 18 fixed on the transparent conductive film 16 via anultraviolet cured resin layer 17.

It should be noted that each organic electroluminescence element, whichemits each luminescence color by itself, is configured by an anodeelectrode 10, an organic layer 11G, 11R, or 11B, and a cathode electrode12. The pixels PL are configured by these organic electroluminescenceelements and thin film transistors 2. Light emitted at the organic layer11G, 11R, or 11B passes through the cathode electrode 12 side to beoutput through the substrate 18. Further, as shown in FIG. 2, the pixelsPL are arranged in a matrix, while the organic layers 11G, 11R, and 11Bare arranged in a regular order.

The substrate 1 is formed of an insulating material. For example, a hardmember such as a glass substrate or a pliable member such as a polyamidefilm or other plastic substrate can be used. It should be appreciatedthat the direction of passage of light emitted by the above organicelectroluminescence element is toward the cathode electrode 12 side, sothe substrate 1 need not be a transparent material.

In the thin film transistor 2, a gate electrode 3 with a predeterminedpattern is formed on the substrate 1, and a polysilicon layer 20 isformed on the gate electrode 3 via a gate insulating layer 5. Further,an interlayer insulating film 4 is formed so as to cover thispolysilicon layer 20.

Further, a source region 21 and a drain region 22 are formed on the gateinsulating film 5 at the gate electrode 3 side. The source region 21 andthe drain region 22 are electrically connected with interconnections 6through contact holes (not shown) formed in the interlayer insulatingfilm 4. An interlayer insulating film 7 is formed so as to cover theseinterconnections 6. Anode electrodes 10 are formed on the interlayerinsulating film 7 corresponding to the pixels PL.

The anode electrodes 10 are connected electrically with interconnections6 through contact holes 8 formed above the interconnections 6 of theinterlayer insulating film 7. A high reflectance, conductive materialwith a large work function such as chrome (Cr), iron (Fe), cobalt (Co),nickel (Ni), copper (Cu), tantalum (Ta), tungsten (W), platinum (Pt),gold (Au) or the like can be used as the material for the interlayerinsulating film 7.

The organic layers 11G, 11R, and 11B are formed on the anode electrodes,and an insulating film 13 is formed so as to cover the periphery of theanode electrodes 10 and enclose the organic layers 11G, 11R, and 11B.The insulating film 13 is formed of, for example, silicon oxide or thelike.

Ribs 14 are formed on this insulating film 13. The ribs 14, as shown inFIG. 2, are arranged between each pixel PL in a matrix form and havetapered side walls. The ribs 14 function as spacers for masks that areused for forming the organic layers 11G, 11R, and 11B on the anodeelectrodes 10 by vapor deposition. That is, the ribs 14 function todefine the distance between the masks and the anode electrodes 10.

Further, each of the ribs 14 is made of an insulating material layer 14a projecting from the insulating film 13 and a conductive material layer14 b formed on the top of this insulating material layer 14 a. Theinsulating material layer 14 a is formed of an organic insulatingmaterial such as polyimide, an inorganic insulating material such assilicon oxide or the like. The conductive material layer 14 b forms anauxiliary electrode connected with the cathode electrode 12 and isformed of a relatively low resistance conductive material such asaluminum (Al), chrome (Cr) or the like.

FIG. 3 is a cross-sectional view of an example of the structure of theorganic layer 11G. Organic layers 11R and 11B are substantially similarto organic layer 11G. As shown in FIG. 3, the organic layer 11G isconfigured with, for example, a positive hole injection layer 11 aformed on the anode electrode 10, a positive hole transfer layer 11 bstacked on this positive hole injection layer 11 a, and a light emittinglayer 11 c stacked on the positive hole transfer layer 11 b serving asan electron transfer layer. The light emitting layer 11 c is covered bythe cathode electrode 12. The positive hole injection layer 11 a, thepositive hole transfer layer 11 b, and the light emitting layer 11 c areformed to predetermined thicknesses by vapor depositing organicmaterials corresponding to the colors of light emitted.

As the organic material of the positive hole injection layer 11 a, forexample, m-MTDATA[4-4′-4″-tris(3-methylphenylphenylamino)triphenylamine]can be used. The thickness of the positive hole injection layer 11 a is,for example, about 30 nm. As the organic material of the positive holetransfer layer 11 b, f

-NPD[4,4-bis(N-1-naphthyl-N-phenylamino)biphenyl] or the like can beused. The thickness of the organic material of the positive holetransfer layer 11 b is, for example, about 20 nm. As the organicmaterial of the light emitting layer 11 c,Alq3[tris(8-quinolinolato)aluminum (III)] or the like can be used. Thethickness of the light emitting layer 11 c is, for example, about 50 nm.

The cathode electrode 12 is formed commonly for the pixels PL, coversthe surface of the ribs 14, and is connected with the conductivematerial layers 14 b consisting of the top portions of the ribs 14.Further, the cathode electrode 12 is insulated from the anode electrodes10 by the organic layers 11G, 11R, and 11B and the insulating film 13.

The cathode electrode 12 is a thin metal film having a small workfunction and higher transmittance such as a magnesium (Mg)-silver (Ag)alloy formed by deposition from binary vapors to a predeterminedthickness. The thickness of the cathode electrode 12 is, for example,about 10 nm.

The transparent conductive film 16 is formed so as to cover the cathodeelectrode 12. The transparent conductive film 16 is formed to apredetermined thickness, for example, by sputtering. A materialexhibiting good conductivity by formation under ordinary temperaturesuch as an indium (In)-zinc (Zn)-oxygen (O)-based material can be usedas the material for the transparent conductive film 16. The thickness ofthe transparent conductive film 16 is, for example, about 200 nm.

The substrate 18 is formed of a transparent material. This is to allowpassage of the light emitted from the light emitting layer 11 c of theorganic layers 11G, 11R, and 11B and striking the substrate through thetransparent layer 16. For example, a hard member such as a glasssubstrate or a pliable member such as a polyamide film or other plasticsubstrate can be used as the transparent material forming the substrate18.

FIG. 4 is a view of the configuration of an apparatus for manufacturingan organic electroluminescence display according to an embodiment of thepresent invention. The apparatus for manufacturing the organicelectroluminescence display 40 forms the above organic layers 11G, 11R,and 11B, the cathode electrode 12, and the transparent conductive film16. As shown in FIG. 4, the manufacturing apparatus 40 is configuredwith a loading unit 50, a green organic layer formation unit 60, a redorganic layer formation unit 70, a blue organic layer formation unit 80,and an electrode formation unit 90.

The loading unit 50 has a substrate loading chamber 51, a pre-processingchamber 52, a mask loading chamber 53, an alignment chamber 54, atransfer work chamber 55, a transfer chamber 56, and a fixture loadingchamber 57. The substrate loading chamber 51, the pre-processing chamber52, the mask loading chamber 53, the alignment chamber 54, the transferwork chamber 55, the transfer chamber 56, and the fixture loadingchamber 57 are configured by vacuum chambers capable of being evacuatedinside to a substantive vacuum atmosphere. Further, the substrateloading chamber 51, the pre-processing chamber 52, the mask loadingchamber 53, the alignment chamber 54, the fixture loading chamber 57,and the transfer chamber 56 are connected to the circumference of thetransfer work chamber 55 via gates Gt. The gates Gt are opened andclosed by gate valves (not shown). Further, these gate valves arecontrolled so as to be opened and closed in response to operations oftransfer robots 45.

The substrate loading chamber 51 can be loaded with a substrate 1 onwhich the organic layers 11G, 11R, and 11B, the cathode electrode 12,and transparent conductive film 16 should be formed. In an embodiment,the substrate loading chamber 51 is a load locked chamber.

FIG. 5 is a cross-sectional view of a portion of the configuration of asubstrate 1 to be loaded into the substrate loading chamber 51. As shownin FIG. 5, ribs 14 functioning as spacers project above the substrate 1.Further, the surfaces of the anode electrodes 10 surrounded by the ribs14 are exposed.

The pre-processing chamber 52 treats the surfaces of the anodes 10 andribs 14 in the state of the substrate 1 shown in FIG. 5. For example, ittreats the surface of the substrate 1 by oxygen plasma. Further, it maytreat it by ultraviolet ozone. The mask loading chamber 53 is loadedwith a mask aligned with and attached (integrally) to the substrate 1.In an embodiment, the mask loading chamber 53 is a load locked chamber.

FIG. 6 is a perspective view of an example of the structure of the maskand the attachment fixture for attaching it to the substrate 1. As shownin FIG. 6, the mask 200 is formed of a plate-shaped member with arectangular contour. The mask 200 is formed of a magnetic substance suchas iron or nickel.

This mask 200 has larger dimensions than that of the substrate 1 and isformed with a number of openings corresponding to patterns of theorganic layers 11R, 11G, and 11B in a mask portion 202 surrounded by anouter frame portion 202. The mask can be used in common for theformation of the organic layers 11R, 11G, and 11B.

That is, the organic layers 11R, 11G, and 11B are regularly arranged onthe substrate 1, thereby making it possible to adjust the alignmentbetween the mask 200 and the substrate 1 to position the openings of themask 200 at the positions of formation of the organic layers 11R, 11G,and 11B of the substrate 1.

The attachment fixture 100 includes a magnet plate 101 havingsubstantially the same dimensions as the contour of the substrate 1 andgrip portions 102 connected to the ends of the magnet plate 101. Partsof the grip portions 102 extend to the sides of the magnet plate 101 soas to project from the ends. These grip portions 102 can be held by armsof the transfer robots 45 (described below). The magnet plate 101 isable to attract the mask 200 by magnetic force.

In FIG. 6, the surface of the magnet plate 101 facing thenon-film-formation surface 1 a side of the substrate 1 forms a contactsurface 101 a coming into full contact with the non-film-formationsurface 1 a of the substrate 1. The substrate 1 and the mask 200 can beattached (integrally) by bringing the contact surface 101 a of themagnet plate 101 into contact with the non-film-formation surface 1 a ofthe substrate 1 in the state with the film-formation surface 1 b of thesubstrate 1 facing the mask 200 and the two aligned.

When the contact surface 101 a of the magnet plate 101 contacts thenon-film-formation surface 1 a of the substrate 1, the mask 200 formedof a magnetic substance is attracted to the magnet plate 101 via thesubstrate 1. Further, the mask portion 201 of the mask 200 is attractedto the film-formation surface 1 b by the magnetic force without slack ofthe mask portion 201. The fixture loading chamber 57 is loaded with theabove attachment fixture 100. The fixture loading chamber 57 is a loadlock chamber.

The transfer work chamber 55 is provided with the transfer robot 45inside. This transfer robot 45 is provided with a number of arms 45 a,45 b, and 45 c pivotally connected in the horizontal direction. Further,the tip of the arm 45 a is provided with a holder 45 d capable ofholding the above substrate 1, the mask 200, and the attachment fixture100. Furthermore, the transfer robot 45 includes a mechanism capable ofelevating the number of arms 45 a, 45 b, and 45 c in the verticaldirection. This transfer robot 45 is controlled to transfer thesubstrate 1, the mask 200, and the attachment fixture 100.

The alignment chamber 54 is provided with an alignment mechanism for thealignment between the above substrate 1 and the mask 200 and theattachment between the substrate 1 and the mask 200 using the attachmentfixture 100.

FIG. 7 is a view of the structure of the alignment chamber 54. It shouldbe noted that alignment chambers 71 and 81 (described below) and thesubstrate/mask separating chamber 93 also include alignment mechanismssimilar to the alignment mechanism shown in FIG. 7.

As shown in FIG. 7, the alignment chamber 54 is provided with a fixtureholder 310 arranged at the upper portion inside a partition wall 300, asubstrate holder 314 below this fixture holder 310, and mask holders 320arranged at the two sides of the substrate holder 314.

The fixture holder 310 is provided with holder portions 310 a at thelower ends. The grip portions 102 of the attachment fixture 100 are heldby these holder portions 310 a. This fixture holder 310 is connectedwith an elevating mechanism 330 arranged at the upper portion outside ofthe partition wall 300 via a connecting rod 311. This elevatingmechanism 330 elevates the fixture holder 310 in the vertical direction(z-direction). The elevating mechanism 330 can be, for example, a servomotor, a transmission mechanism, or the like.

The substrate holder 314 is provided with a connecting part 315connected to a rotatable shaft 317, a number of supports 316 standing atthe two ends of this connecting part 315 and can support the peripheryof the film-formation surface 1 b of the substrate 1 by the tips of thesupport 316. It should be noted that the supports 316 can be insertedinto holes formed at the four corners of the mask portion 201 of themask 200 shown in FIG. 6. The rotatable shaft 317 connected to thesubstrate holder 314 is connected to a movement/rotation mechanism 340arranged at the outside of the bottom of the partition wall 300.

This movement/rotation mechanism 340 holds the substrate holder 314rotatably in the rotational direction f

 around the rotatable shaft 317 and movably holds the substrate holder314 in the z-direction and the x- and y-direction perpendicularlyintersecting the z-direction. The movement/rotation mechanism 340 maybe, for example, a servo motor, a transmission mechanism, or the like.

The mask holders 320 can support the two ends of the bottom surface ofthe above mask 200. Each mask holder 320 is connected to an elevatingmechanism 350 via a connecting rod 321. The elevating mechanism 350holds the mask holder 320 movably in the z-direction. It should beappreciated that the elevating mechanism 350 is shown split in FIG. 7,but is actually a single mechanism and simultaneously elevates the maskholders 320.

The transfer chamber 56 includes a loading path for loading thesubstrate 1 and the mask 200 attached by the attachment fixture 100 inthe alignment chamber 54 to the green organic layer formation unit 60.The green organic layer formation unit 60 forms the green organic layer11G. This green organic layer formation unit 60 includes a transfer workchamber 61 and a number of vapor deposition processing chambers 62, 63,and 64. The transfer work chamber 61 and a number of vapor depositionprocessing chambers 62, 63 and 64 include vacuum chambers that arecapable of being evacuated inside to a substantive vacuum atmosphere.Further, the vapor deposition processing chambers 62, 63, and 64 areconnected to the circumference of the transfer work chamber 61 via gatesGt.

The above configured transfer robot 45 is arranged in the transfer workchamber 61. This transfer robot 45 transfers the substrate 1 and themask 200 between the vapor deposition processing chambers 62, 63, and 64and to the red organic layer formation unit 70. The vapor depositionprocessing chamber 62 forms the hole injection layer 11 a of the organiclayer 11G. The vapor deposition processing chamber 63 forms the holetransfer layer 11 b of the organic layer 11G. The vapor depositionprocessing chamber 64 forms the light emitting layer 11 c of the organiclayer 11G.

FIG. 8 is a cross-sectional view of an example of the configuration ofthe vapor deposition processing chambers 62, 63, and 64. It should benoted that the vapor deposition processing chambers 73, 74, and 75 inthe red organic layer formation unit 70 (described below) and the vapordeposition processing chambers 83, 84, and 85 in the blue organic layerformation unit 80 (described below) also have basically the sameconfigurations as the configuration shown in FIG. 8.

As shown in FIG. 8, a fixture holder 401 is arranged at the top of theinside of the partition wall 400 and is capable of holding theattachment fixture 100 attaching the substrate 1 to the mask 200. Thisfixture holder 401 is provided with holding portions 401 a holding thegrip portions 102 of the attachment fixture 100 at its lower ends.Further, the fixture holder 401 is connected with a rotatable shaft 402.The rotatable shaft 402 is connected to the rotating mechanism 430arranged at the top outside of the partition wall 400.

The rotating mechanism 430 rotates the rotatable shaft 402 at apredetermined speed at the time of vapor deposition. The rotatingmechanism 430 can be, for example, a servo motor, a transmissionmechanism, or the like.

When the rotatable shaft 402 is rotated by the rotating mechanism 430,the substrate 1 and the mask 200 also rotate around the rotatable shaft402.

A heating vessel 420 is arranged under the partition wall 400. Theheating vessel 420 holds a vapor deposition material Vs made of theabove described organic material.

This heating vessel 420 is provided with an opening 420 a on the topend. A shutter 440 opening and closing the opening 420 a is arrangedabove this opening 420 a. The shutter 440 is driven by a movementmechanism (not shown) in the opening and closing directions C1 and C2.This shutter 440 is arranged for preventing wasted consumption of theorganic material by closing the opening 420 a when not performing vapordeposition.

An induction coil 421 is built into the heating vessel 420. Thisinduction coil 421 is connected with an alternating current supply 422.By supplying an alternating current to the induction coil 421 from thealternating current supply 422, the heating vessel 420 itself is heatedby an electromagnetic field generated from the induction coil 421. Thus,the vapor deposition material Vs accommodated in the heating vessel 420is evaporated. It should be noted that the alternating current supply422 can control the temperature of the heating vessel 420 by adjustingthe supplied current.

The red organic layer formation unit 70 forms the organic layer 11R.This red organic layer formation unit 70 includes an alignment chamber71, a transfer work chamber 72, and a number of vapor depositionprocessing units 73, 74, and 75. The transfer work chamber 72 and vapordeposition processing units 73, 74, and 75 are configured by vacuumchambers that are capable of being evacuated inside them to asubstantive vacuum atmosphere. Further, the vapor deposition processingunits 73, 74, and 75 are connected to the circumference of the transferwork chamber 72 via the gates Gt.

The alignment chamber 71 includes the same alignment mechanism as thealignment chamber 54 of the loading unit 50. This alignment chamber 71separates the substrate 1 and the mask 200 as attached in the alignmentchamber 54, realigns the substrate 1 and the mask 200, and reattachesthe substrate 1 and the mask 200 by the attachment fixture 100.

The above configured transfer robot 45 is arranged in the transfer workchamber 72. This transfer robot 45 transfers the substrate 1 and themask 200 between the vapor deposition processing units 73, 74, and 75and to the blue organic layer formation unit 80. The vapor depositionprocessing chamber 73 forms the hole injection layer 11 a of the organiclayer 11R. The vapor deposition processing chamber 74 forms the holetransfer layer 11 b of the organic layer 11R. The vapor depositionprocessing chamber 73 forms the light emitting layer 11 c of the organiclayer 11R.

The blue organic layer formation unit 80 forms the organic layer 11B.This blue organic layer formation unit 80 includes an alignment chamber81, a transfer work chamber 82, and a number of vapor depositionprocessing units 83, 84, and 85.

The alignment chamber 81 includes the same alignment mechanism as thealignment chamber 71 of the red organic layer formation unit 70. Thisalignment chamber 81 separates the substrate 1 and the mask 200 attachedin the alignment chamber 71, realigns the substrate 1 and the mask 200,and reattaches the substrate 1 and the mask 200 by the attachmentfixture 100.

The above configured transfer robot 45 is arranged in the transfer workchamber 82. This transfer robot 45 can transfer the substrate 1 and themask 200 between the vapor deposition processing units 83, 84, and 85and to the electrode formation unit 90. The vapor deposition processingchamber 83 forms the hole injection layer 11 a of the organic layer 11B.The vapor deposition processing chamber 84 forms the hole injectiontransfer layer 11 b of the organic layer 11B. The vapor depositionprocessing chamber 85 forms the light emitting layer 11 c of the organiclayer 11B.

The electrode formation unit 90 includes a loading chamber 91, atransfer work chamber 92, a substrate/mask separation chamber 93, anelectrode formation unit 94, a sputtering chamber 95, a substrateunloading chamber 96, and a fixture/mask unloading chamber 97. Theloading chamber 91, the transfer work chamber 92, the substrate/maskseparation chamber 93, the electrode formation unit 94, the sputteringchamber 95, the substrate unloading chamber 96, and the fixture/maskunloading chamber 97 are configured by vacuum chambers capable of beingevacuated inside to a substantive vacuum atmosphere. Further, theloading chamber 91, the transfer work chamber 92, the substrate/maskseparation chamber 93, the electrode formation unit 94, the sputteringchamber 95, the substrate unloading chamber 96, and the fixture/maskunloading chamber 97 are connected to the circumference of the transferwork chamber 92 via the gates Gt.

The loading chamber 91 includes a loading path for loading the substrate1 and the mask 200 after the formation of the organic layer 11B in theblue organic layer formation unit 80 to the transfer work chamber 92.The substrate/mask separation chamber 93 includes the same alignmentmechanism as the above described alignment chambers 54, 71, and 81. Thissubstrate/mask separation chamber 93 separates the substrate 1 and themask 200 attached by the attachment fixture 100 by the alignmentmechanism.

The electrode formation chamber 94 is provided with a vapor depositionapparatus for forming the above cathode electrode 12 on the substrate 1after being separated from the mask 200. It should be noted that thisvapor deposition apparatus is a well-known vapor deposition apparatus,so a detailed explanation of the vapor deposition apparatus will beomitted.

The sputtering chamber 95 forms the above described transparentconductive film 16 on the substrate 1 after the cathode electrode 12 isformed by sputtering. The sputtering chamber 95 is provided, forexample, with a direct current sputtering apparatus. It should be notedthat the direct current sputtering apparatus is well known, so adetailed explanation of the direct current sputtering apparatus will beomitted.

The substrate unloading chamber 96 is a vacuum chamber for unloading thesubstrate 1 after the transparent conductive film 16 is formed from theelectrode formation unit 90. The fixture/mask unloading chamber 97 is avacuum chamber for unloading the mask 200 and the attachment fixture 100after being separated from the substrate 1 from the electrode formationunit 90. The transfer work chamber 92 is provided with the aboveconfigured transfer robot 45. This transfer robot 45 transfers thesubstrate 1, the mask 200, and the attachment fixture 100.

Next, an explanation will be made of a method of manufacturing anorganic electroluminescence display using the above manufacturingapparatus 40. First, the necessary number of substrates 1 in the stateshown in FIG. 5 are loaded into the substrate loading chamber 57 inadvance. Further, the necessary number of the masks 200 are loaded intothe mask loading chamber 53 in advance. Furthermore, the necessarynumber of attachment fixtures 100 are loaded into the fixture loadingchamber 57.

Conversely, the heating vessel 420 of each of the green organic layerformation unit 60, the red organic layer formation unit 70, and the blueorganic layer formation unit 80 is heated in advance so that thetemperature of the vapor deposition material Vs is controlled so as tobe evaporated at a constant evaporation rate. It should be noted thatthe heating vessel 420 is closed by the shutter 440 in advance. Further,it is preferable that the evaporation rate in each of the green organiclayer formation unit 60, the red organic layer formation unit 70, andthe blue organic layer formation unit 80 be controlled in accordancewith the time for forming a film in the evaporating chamber which formsthe thickest layer. That is, the cycle time in an organic layerformation process depends on the time for forming the thickest layer.

Next, the gate valve of the substrate loading chamber 57 is opened toload the substrate 1 in the substrate loading chamber 57 into thepre-processing chamber 52 by the transfer robot 45. The pre-processingchamber 52 uses oxygen plasma to treat the substrate 1 under theconditions of, for example, 400 sccm, 50W of a high frequency power, and120 sec of treatment time.

Before the completion of this oxygen plasma treatment, as shown in FIG.9, the attachment fixture 100 in the fixture loading chamber 57 is heldby the holder 45 d of the transfer robot 45 and loaded into thealignment chamber 54. In FIG. 9, the grip portions 102 of the attachmentfixture 100 loaded into the alignment chamber 54 through the gate Gt arepositioned to be able to be held by the holder portions 310 a of thefixture holder 310.

Further, as shown in FIG. 10, the fixture holder 310 is elevated to apredetermined position by the elevating mechanism 330. By the elevationof the fixture holder 310, the attachment fixture 100 is separated fromthe holder 45 d of the transfer robot 45 so that the attachment fixture100 is held by the fixture holder 310.

Further, as shown in FIG. 10, after the completion of the transfer ofthe attachment fixture 100 to the alignment chamber 54, the transferrobot 45 loads the mask 200 in the mask loading chamber 53 into thealignment chamber 54. The loading position of the mask 200 is betweenthe attachment fixture and the mask holder 320.

From this state, as shown in FIG. 11, the mask holder 320 is elevated toa predetermined position by the elevating mechanism 350. By theelevation of the mask holder 320, the mask 200 is separated from theholder of the transfer robot 45 and held by the mask holder 320.

Next, in the state with the attachment fixture 100 held by the fixtureholder 310 and the mask 200 held by the mask holder 320, as shown inFIG. 12, the substrate 1 finished being treated on its surface in thepre-processing chamber 52 is loaded into the alignment chamber 54 by thetransfer robot 45.

As shown in FIG. 12, before loading the substrate 1 into the alignmentchamber 54, the mask holder 320 is lowered to a predetermined positionand a space is formed where there is no interference with the substrate1 between the attachment fixture 100 and the mask 200.

Next, as shown in FIG. 13, the substrate holder 314 is elevated to apredetermined position by the movement/rotation mechanism 340. By theelevation of the substrate holder 314, the substrate 1 is separated fromthe holder 45 d of the transfer robot 45 and held by the supports 316.

As a result, the attachment fixture 100 is held by the fixture holder310, the mask 200 is held by the mask holder 320, and the substrate 1 isheld by the substrate holder 314.

Next, by adjusting the rotational position of the substrate 1 in the f

 direction and the position in the X- and Y-directions by themovement/rotation mechanism 340 from the above state, the substrate 1and mask 200 are aligned. This alignment work is based on theinformation of the position and posture of the substrate 1 with respectto the mask 200 obtained by image processing of the images of the mask200 and substrate 1 taken by, for example, an image pickup device (notshown).

Further, as shown in FIG. 14, the alignment is performed so that theopening 200 h of the mask 200 is located at the position of formation ofthe organic layer 11G to be formed on the substrate 1.

After the completion of the alignment work between the substrate 1 andthe mask 200, as shown in FIG. 15, the mask holder 320 is elevated to apredetermined position to bring the substrate 1 into contact with themask 200 and place the substrate 1 on the mask 200.

From this state, as shown in FIG. 16, the mask holder 320 is furtherelevated to bring the substrate 1 into contact with the attachmentfixture 100. As a result, the mask 200 is attracted to the magnet plate101 by the magnetic force of the magnet plate 101 so that the mask 200and the substrate 1 are attached and alignment is maintained.

Further, by the attachment of the mask 200 and the substrate 1, as shownin FIG. 14, the mask 200 contacts the tops of the ribs 14 so that thedistance between the mask 200 and the anode electrode 10 is maintainedconstant.

Next, as shown in FIG. 16, in the state with the attached attachmentfixture 100, substrate 1, and mask 200 held by the mask holder 320, theholder 45 d of the transfer robot 45 is inserted below the mask 200.Further, by lowering the mask holder 320, the attached attachmentfixture 100, substrate 1, and mask 200 become held by the fixture holder310. In this state, by lowering the fixture holder 310 to apredetermined position, the attached attachment fixture 100, substrate1, and mask 200 are placed on the holder 45 d of the transfer robot 45.

Next, the attached attachment fixture 100, substrate 1, and mask 200placed on the holder 45 d of the transfer robot 45 are transferred tothe transfer chamber 56. Next, the attached attachment fixture 100,substrate 1, and mask 200 transferred to the transfer chamber 56 aretransferred to the vapor deposition processing chamber 62 by thetransfer robot 45 arranged in the transfer work chamber 61.

As shown in FIG. 17, the attached attachment fixture 100, substrate 1,and mask 200 transferred inside the partition wall 400 of the vapordeposition processing chamber 62 through the gate Gt are held by thefixture holder 401 by lowering the holder portion 45 d of the transferrobot 45 to a predetermined position.

After the substrate 1 and the mask 200 are held by the fixture holder401, as shown in FIG. 18, the fixture holder 401 is made to rotate at apredetermined rotational speed and the shutter 440 is opened for thevapor deposition to form the hole injection layer 11 a of the organiclayer 11G to a predetermined thickness. The time for forming the holeinjection layer 11 a is determined by the vapor deposition rate.Further, by rotating the substrate 1 and the mask 200, the holeinjection layer 11 a is formed to a uniform thickness.

After forming the hole injection layer 11 a, the same proceduredescribed above is used to transfer the attached attachment fixture 100,substrate 1, and mask 200 to the vapor deposition processing chamber 63by the transfer robot 45 provided in the transfer work chamber 61 toform the hole transfer layer 11 b of the organic layer 11G.

The light emitting layer 11 c of the organic layer 11G is formed in thevapor deposition processing chamber 64 in the same way. As a result, theorganic layer 11G including the hole injection layer 11 a, the holetransfer layer 11 b, and the light emitting layer 11 c is formed stackedon the anode electrodes 10 of the substrate 1. Next, the substrate 1formed with the organic layer 11G is transferred to the alignmentchamber 71 of the red organic layer formation unit 70 in the stateattached to the mask 200.

As shown in FIG. 19, after the substrate 1 and the mask 200 attached bythe attachment fixture 100 is loaded into the alignment chamber 71 bythe holder 45 of the transfer robot 45, the mask holder 320 is elevatedto a predetermined position to separate the mask 200 from the holder 45d and hold them by the mask holder 320.

Next, as show in FIG. 20, the fixture holder 310 is elevated to apredetermined position. By this elevation of the fixture holder 310,only the attachment fixture 100 is separated from the substrate 1 andthe mask 200.

From the state with only the attachment fixture 100 separated from thesubstrate 1 and the mask 200, the substrate holder 314 is elevated to apredetermined position. Due to the elevation of the substrate holder314, the substrate 1 and the mask 200 are separated.

As a result, the attachment fixture 100 is held by the fixture holder310, the mask is held by the mask holder 320, and the substrate 1 isheld by the substrate holder 314. From this state, in the same way withthe operation explained with reference to FIG. 15 and FIG. 16, thesubstrate 1 and the mask 200 are realigned.

In the alignment chamber 71, as shown in FIG. 21, an alignment isperformed so that the opening 200 h of the mask 200 is located at theposition of formation of the organic layer 11R to be formed on thesubstrate 1.

After completing the alignment, the same procedure is used as in theoperation explained with reference to FIG. 15 and FIG. 16 to reattachthe substrate 1 and the mask 200 by the attachment fixture 100 andsequentially transfer the substrate 1 and the mask 200 in the attachedstate to the vapor deposition processing chambers 73, 74, and 75 to formthe hole injection layer 11 a, the hole transfer layer 11 b, and thelight emitting layer 11 c of the organic layer 11R.

After forming the organic layer 11R, the attached substrate 1 and mask200 are transferred into the alignment chamber 81 and, in the same wayas the operation in the alignment chamber 71, the substrate 1 and themask 200 are aligned and reattached by the attachment fixture 100.

In the alignment chamber 81, as shown in FIG. 21, alignment is performedso that the opening 200 h of the mask 200 is located at the position offormation of the organic layer 11R to be formed on the substrate 1.

After completing the alignment, the same procedure is used as theoperation explained with reference to FIG. 15 and FIG. 16 to reattachthe substrate 1 and the mask 200 by the attachment fixture 100 andsequentially transfer the attached substrate 1 and the mask 200 to thevapor deposition processing chambers 83, 84, and 85 to form the holeinjection layer 11 a, the hole transfer layer 11 b, and the lightemitting layer 11 c of the organic layer 11B.

After forming the organic layer 11B, the attached substrate 1 and themask 200 are transferred to the electrode formation unit 90. In theelectrode formation unit 90, the attached substrate 1 and mask 200 arefirst loaded into the substrate/mask separation chamber 93.

In the substrate/mask separation chamber 93, the attached substrate 1and the mask 200 are separated. It should be noted that thesubstrate/mask separation chamber 93 is provided with the same alignmentmechanism as the alignment chamber 81 or the like. By operating thisalignment mechanism by a predetermined procedure, it becomes possible toseparate the attachment fixture 100, the substrate 1, and the mask 200.

After separating the substrate 1 and the mask 200, the substrate 1 istransferred to the electrode formation chamber 94, while the attachmentfixture 100 and the mask 200 are transferred to the fixture/maskunloading chamber 97.

In the electrode formation chamber 94, the cathode 12 is formed by vapordeposition. Specifically, by co-deposition of, for example, magnesium(Mg) and silver (Ag), a cathode electrode 12 made of a Mg—Ag alloy isformed. The film thickness is, for example, about 10 nm. Further, theratio of the film formation speed between the Mg and Ag is about 9:1.

Next, after forming the cathode electrode 12 on the organic layers 11G,11R, and 11B of the substrate 1, the substrate 1 is loaded into thesputtering chamber 95, then the transparent conductive layer 16 isformed on the cathode electrode 12. The film formation conditions are asfollows: a sputtering gas of a mixed gas of, for example, argon (Ar) andoxygen (O2) (volume ratio of Ar/O2=1000), a pressure of about 0.3 Pa,and an output of the direct current sputtering apparatus of 40W.

Next, after forming the transparent conductive film 16, the substrate 1is loaded into the substrate unloading chamber 96. The substrate 1transferred to the substrate unloading chamber 96 is unloaded from thesubstrate unloading chamber 96, then fixed to the substrate 18 via theultraviolet cured resin layer 17. Thus, the assembly of the organicelectroluminescence display is completed.

Further, the mask 200 and the attachment fixture 100 separated in thesubstrate/mask separation chamber 93 are transferred to the fixture/maskunloading chamber 97. The mask 200 and the attachment fixture 100 loadedto the fixture/mask unloading chamber 97 are unloaded from thefixture/mask unloading chamber 97, then reused.

It should be appreciated that by inspecting whether there is a defect inthe mask 200 before being reused, it becomes possible to avoid reusing amask 200 with a defect and prevent an inferior organicelectroluminescence display from being manufactured.

As described above, according to an embodiment, by dividing theformation of the organic layers 11G, 11R, and 11B including the numberof the organic material layers among different vapor depositionprocessing chambers, it is possible to suppress waste of the organicmaterial used for vapor deposition.

Further, according to an embodiment, since the number of organicmaterial layers are formed continuously in the state with the substrate1 and the mask 200 aligned and attached, the time for the alignment ineach of the vapor deposition processing chambers becomes unnecessary, sothe cycle time can be shortened.

Furthermore, according to an embodiment, since no alignment mechanism isneeded in each vapor deposition processing chamber, it becomes possibleto reduce the equipment costs.

Furthermore, according to an embodiment, because of using the mask 200for each substrate 1, it becomes possible to manufacture different typesof organic electroluminescence displays in the same assembly line.

In the above described embodiments, a configuration where a single vapordeposition source is arranged in the vapor deposition chamber and onlyone organic material layer is formed in one vapor deposition chamber isemployed, but it is also possible to employ a configuration where anumber of vapor deposition sources are arranged in a vapor depositionchamber and a number of organic material layers are formed in one vapordeposition chamber.

For example, when there is an organic material layer taking an extremelylong time to be formed, by arranging a single vapor deposition sourcefor this organic material layer to form only this organic material layertaking a long time to be formed and arranging a number of vapordeposition sources for the other organic material layers taking a shorttime to be formed, it becomes possible to prevent the cycle time frombeing extended.

Furthermore, in the above described embodiments, explanation was givenwith reference to an organic layer including three stacked organicmaterial layers, but by applying the present invention to an organiclayer including more stacked organic material layers, a greater effectwill be obtained from the viewpoint of productivity and the consumptionof the organic materials.

Furthermore, in the above described embodiments, when the work in eachchamber has no influence on the work in the other chambers, it isunnecessary to partition off the chambers by the gates Gt.

Further, the arrangement of the chambers is not limited to a clusterarrangement. It is possible to select from a straight arrangement, aU-shaped arrangement, or any other preferable or suitable arrangementsin accordance with the order of work.

According to an embodiment of the present invention, it is possible toshorten the cycle time of the process for forming the organic layer ofan organic electroluminescence display, so mass production of theorganic electroluminescence display becomes possible.

Further, according to an embodiment of the present invention, it ispossible to suppress waste of the organic materials used for forming theorganic layer, so the costs of producing the organic electroluminescencedisplay can be reduced.

It should be understood that various changes and modifications to thepresently preferred embodiments described herein will be apparent tothose skilled in the art. Such changes and modifications can be madewithout departing from the spirit and scope of the present invention andwithout diminishing its intended advantages. It is therefore intendedthat such changes and modifications be covered by the appended claims.

1. A method of manufacturing an organic electroluminescence display, themethod comprising the steps of: providing a substrate; forming a firstelectrode layer on the substrate in a predetermined pattern; aligning ina first alignment chamber a mask having openings corresponding to thepredetermined pattern with the substrate on which the first electrodelayer is formed; detachably attaching the mask and the substrate with amagnetic force; transferring the mask and the substrate in amagnetically attached state to a first formation unit; forming a firstorganic layer for a first color by sequentially forming a plurality oforganic material layers in a plurality of vacuum processing chambers inthe first formation unit; transferring the mask and the substrate in anattached state to a second alignment chamber connecting the firstformation unit to a second formation unit, such that the first formationunit, the second alignment chamber and the second formation unit areconnected in series, thereby providing for flow-through processing;realigning in the second alignment chamber the mask with the substrate;detachably reattaching the mask and the substrate with a magnetic force;transferring the mask and the substrate in a magnetically attached stateto the second formation unit; forming a second organic layer for asecond color by sequentially forming a plurality of organic materiallayers in a plurality of vacuum processing chambers in the secondformation unit; the first and second organic layers being stacked on thefirst electrode layer formed on the substrate; and forming a secondelectrode layer on the first and second organic layers, wherein thesteps of attaching and separating the mask and the substrate and thestep of transferring the attached mask and substrate are all performedin a vacuum atmosphere, and wherein for each of the first and secondorganic layers, the substrate is attached to the mask with a magneticforce throughout the formation of the organic layer such that the maskand the substrate do not require realignment with each other during theformation of the plurality of organic material layers.
 2. A method ofmanufacturing an organic electroluminescence display as claimed in claim1, wherein each of the organic material layers formed in the firstformation unit is formed in a different one of the vacuum processingchambers, and wherein each of the organic material layers formed in thesecond formation unit is formed in a different one of the vacuumprocessing chambers.
 3. A method of manufacturing an organicelectroluminescence display as claimed in claim 2, the method furthercomprising the steps of: providing vapor deposition sources for thevacuum processing chambers, the vapor deposition sources supplyingorganic materials for forming the organic material layers; andconfiguring the vapor deposition sources to supply organic materials atpredetermined evaporation rates when the substrate and the mask areloaded into the vacuum processing chambers.
 4. A method of manufacturingan organic electroluminescence display as claimed in claim 1, whereinthe mask and the substrate are magnetically attached using a mask formedof a magnetic material and a magnet.
 5. A method of manufacturing anorganic electroluminescence display as claimed in claim 4, wherein thestep of detachably attaching the mask and the substrate with a magneticforce further includes sandwiching the substrate between the mask and aplate-shaped magnet provided with a contact surface fully contacting anon-film formation surface side of the substrate.
 6. A method ofmanufacturing an organic electroluminescence display as claimed in claim1, further comprising the step of separating the mask and the substrateafter the steps of forming the first and second organic layers andforming the second electrode layer.
 7. A method of manufacturing anorganic electroluminescence display as claimed in claim 1, the methodfurther comprising the steps of: separating the mask and the substrateafter forming the first and second organic layers; and forming thesecond electrode layer so as to cover the first and second organiclayers in a vacuum processing chamber.
 8. A method of manufacturing anorganic electroluminescence display as claimed in claim 1, wherein thesteps of aligning the mask in the first alignment chamber and detachablyattaching the mask and the substrate with a magnetic force occur in aloading unit, the loading having a plurality of vacuum processingchambers and being connected in series with the first formation unitthrough a transfer chamber, thereby providing flow-through processing.9. A method of manufacturing an organic electroluminescence display asclaimed in claim 1, the method further comprising the steps of:transferring the mask and the substrate in a magnetically attached stateto a third alignment chamber connecting the second formation unit to athird formation unit, wherein the first formation unit, the secondalignment chamber, the second formation unit, the third alignmentchamber, and the third formation unit are connected in series, therebyproviding flow-through processing.
 10. A method of manufacturing anorganic electroluminescence display as claimed in claim 9, the methodfurther comprising the step of forming a third organic layer for a thirdcolor by sequentially forming a plurality of organic material layers inthe third formation unit, thereby providing flow-through processing. 11.A method of manufacturing an organic electroluminescence display asclaimed in claim 1, wherein the second alignment chamber includes aninput end connected to the first formation unit and an output endconnected to the second formation unit.
 12. A method of manufacturing anorganic electroluminescence display as claimed in claim 1, wherein thestep of forming the first organic layer for the first color in the firstformation unit includes forming on the substrate, at a first colorposition, a hole injection layer in a first one of the vacuum processingchambers, a hole transfer layer in a second one of the vacuum processingchambers, and a light emitting layer in a third one of the vacuumprocessing chambers.
 13. A method of manufacturing an organicelectroluminescence display as claimed in claim 12, wherein each of thehole injection layer, the hole transfer layer, and the light emittinglayer is formed with a predetermined thickness corresponding to anemitting color.
 14. A method of manufacturing an organicelectroluminescence display as claimed in claim 13, the method includingforming a second electrode layer on the organic layer.
 15. A method ofmanufacturing an organic electroluminescence display as claimed in claim1, the method including forming a first electrode layer on thesubstrate, wherein forming the first organic layer for the firstemitting color in the first formation unit includes forming on the firstelectrode layer, in a predetermined pattern, an organic layer includinga hole injection layer, a hole transfer layer, and a light emittinglayer, and wherein each of the hole injection layer, the hole transferlayer, and the light emitting layers is provided with a predeterminedthickness corresponding to the first emitting color.
 16. A method ofmanufacturing an organic electroluminescence display as claimed in claim1, wherein for each of the first and second formation units, theplurality of vacuum processing chambers are arranged in a cluster unitaround a central processing chamber to form a first cluster unit and asecond cluster unit, respectively, and wherein the first alignmentchamber is connected to the first cluster unit and wherein the secondalignment chamber is connected to the first cluster unit and secondcluster unit.